"VPE also supports heterogeneous integration for high performance computing and high power modules," said Li-Cheng Shen, AVP of the MCC in USI. He added that three Wi-Fi modules developed with VPE ...
DUBLIN–(BUSINESS WIRE)–Feb 8, 2021– The "System in Package Technology Market Forecast to 2027 – COVID-19 Impact and Global Analysis By Packaging Technology; by Packaging Type; Interconnection ...
A new technical paper titled “Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration” was published by researchers at University ...
Spectrum Control has unveiled a new RF front-end system-in-package (SiP) platform as part of its SCi Blocks family. The SCRS series RF+ SiP with integrated digital control addresses size and ...
Leading semiconductor companies like NXP, Nvidia and MediaTek are working on using AI in future smart cockpits. Universal Scientific Industrial (USI), which is experienced in system-in-package (SiP) ...
A new system-in-package (SiP) technology is capable of stacking logic and Gbit-class memory in a single package to enable high-speed, high-definition image processing in mobile devices. The technology ...
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in system-in-package (SiP) modules, has announced plans to open a subsidiary in Vietnam for US$20 million. The ...
Microchip’s SAMA7D65 MPU runs 1 GHz Arm® Cortex®-A7 core and integrates MIPI DSI®, LVDS display interfaces and 2D GPU for Human-Machine Interface (HMI) applications CHANDLER, Ariz., Feb. 26, 2025 ...
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