Consumer demand is driving the need for ever-faster silicon chips, also known as integrated circuits (ICs) or semiconductors.
Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...
Sil-Pad Selection Guide – Thermally Conductive Interface Materials for Cooling Electronic Assemblies
This is a comprehensive catalog that includes information on most Bergquist thermal interface materials. Sections include Gap Pad Thermally Conductive Materials, Gap Filler Liquid Dispensable ...
Higher power density, smaller form factors and long-life reliability expectations all collide, requiring better thermal ...
This product provides designers of electronics and telecoms devices with a thermal conductivity of 8.3 W/m-K for superior heat transfer. Said to have the highest available thermal conductivity in its ...
With the PhaseSheet PTM, Thermal Grizzly Holding GmbH presents an electrically non-conductive thermal pad based on a phase change material (PCM). With PhaseSheet PTM, Thermal Grizzly closes the gap ...
Reapplying a fresh layer of thermal paste to a graphics card's GPU is quite easy but dealing with its thermal pads is another matter altogether. Thermal Grizzly reckons it has the perfect solution, in ...
An updated product page for the new RTX 5070 Ti WindForce OC V2 graphics card reveals that it retains most of the specifications of the existing ...
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