The patented CSP/BallNest Hybrid Socket enables prototyping, test, or burn-in of CSP, BGA, microBGA, and LGA devices. The socket features a lid that nests each ball termination for connection ...
Thanks to LGA certification via type testing/structural type analysis of the Donauer Flat Roof and Flat Roof Duplex mounting frames by the LGA Test Office for Structural Analysis, Donauer Solartechnik ...
Ironwood Electronics rolled out its B-LGA20A-Z-01 Socket Probe Adapter which allows high-speed testing of LGA device while accessing the signals using testers via header pins. Features of the ...
TL;DR: Intel is developing a new LGA 1954 socket for its 2026 Nova Lake-S desktop CPUs, featuring up to 16 P-Cores and 32 E-Cores. This marks Intel's third major socket change in recent generations, ...
Ironwood Electronics' latest LGA socket addresses high-performance requirements for 0.52mm pitch LGA104 – CBT-LGA-5031. The contactor is a stamped spring pin with 14 gram actuation force per pin and ...
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