Driving R&D of glass components for scaling of semiconductor packaging substrates Tokyo, Japan, December 16, 2025-- TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN ...

The artificial intelligence (AI) revolution has expanded rapidly since 2023, powering applications from chatbots to ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

WEST LAFAYETTE, Ind. — It’s official. SK hynix Inc., the world’s leading producer of high-bandwidth memory chips, will invest an estimated $3.87 billion in West Lafayette to build an advanced ...

Purdue University President Mung Chiang made it official Wednesday: South Korea-based semiconductor chipmaker SK Hynix Inc. plans to establish a nearly $4 billion advanced packaging fabrication and ...

Taiwanese IC packaging and testing firms express a mix of opportunity and caution as Nvidia's US$500B AI push unfolds. While Nvidia's US-centric AI supply chain creates demand for their expertise, the ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot production line project.

Purdue University President Mung Chiang speaks during a press conference Wednesday in West Lafayette. Purdue University President Mung Chiang made it official Wednesday: South Korea-based ...