New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

Paras Defence and Space Technologies Ltd. on Monday announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking its entry into the semiconductor segment with a focus on advanced ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Ottawa, Nov. 04, 2025 (GLOBE NEWSWIRE) -- The global semiconductor packaging market, valued at USD 49.89 billion in 2025, is expected to rise to approximately USD 119.96 billion in 2034, based on a ...

SK Hynix has revealed plans to establish a new company in Indiana through its third quarter 2024 business report, marking a significant step toward building a semiconductor packaging production base.

A new technical paper titled “Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging” was published by researchers at University of ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...