Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...

To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...