Huawei CEO Ren Zhengfei during an interview in Taiyuan, Shanxi province, China, Feb. 9, 2021. Huawei, the Chinese tech giant, has borne the brunt of U.S. restrictions since 2019, when Washington ...
Engineers develop GaN semiconductors, liquid cooling systems and chiplet packaging to handle growing AI power demands in data ...
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Why chip packaging is the next big thing
As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...
This TechXchange examines chip packaging technology including new advances such as chiplets. Check out the video series on chip packaging. Packaging: A 30-Year Career Retrospective We’ve come a very ...
Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...
This article was originally published on ARPU. View the original post here. In a prominently placed interview with China's state newspaper, Huawei founder Ren Zhengfei sent a clear message to ...
Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...
Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...
Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...
ALBANY, N.Y. — Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, will invest $575 million to create a new center for advanced ...
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