South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

TSMC's faces costs, politics, and capacity obstacles. Once framed as politically motivated, TSMC's US expansion has evolved into a costly long-term commitment exceeding US$165 bil ...

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

Just as the new plant located in Nanke Chiayi Park in Taiwan is expanding production, the downstream supply chain broke news that TSMC is eyeing off going to Pingtung to build a new CoWoS advanced ...

SK Hynix ( HXSC.F) plans to invest 19 trillion Korean won ($12.9 billion) to build a new advanced packaging plant in the ...

TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant ...

The world of AI chips hasn't stopped, and won't stop, with advanced packaging production capacity in short supply. TSMC's new CoWoS plant in Nanke Chiayi Park is entering the "environmental review ...

TSMC’s advanced packaging capacity is fully booked until 2025 due to hyper demand for large, powerful chips from cloud service giants like Amazon AWS, Microsoft, Google, and Meta. Nvidia and AMD are ...